Study of the parameters of an electrolysis bath affecting the size and the shape of electrodeposited copper nodules

Abstract

This thesis aimed to improve the surface treatment of so called low-loss copper foils. Indeed, for applications where high signal speeds are required (latest computers, 5G/6G smartphones), the signal tends to flow preferentially into the copper surface. It is therefore necessary to reduce the roughness of the low-loss copper foil as much as possible. However, the roughness of the foil is necessary to obtain good adhesion between the copper foil and the prepreg, a polymer attached to the copper for the design of printed circuits. The aim is therefore to find a compromise between low signal loss and good adhesion to the prepreg.